Operation Information > Technology and Capability

 

 
PCB Technology & Capability
   
 
Descriptions Technology & Capability
Product Range Rigid Printed Circuits Board, single sided up to 14 layers
Min. Board Thickness
Single Side Double Side Multi-layer
0.8 mm min. 
Paper Phenolic 
(i.e. : FR-1)

0.20 mm min.
Glass Epoxy 
(i.e. FR-4)
4 
layer
6 
layer
8 
layer
10 
layer

12 & 14 layer
0.40mm 1.00mm 1.20mm 1.50mm 1.60mm
Max. Board Size 508 x 610 mm ( 20" x 24" )
Base Material FR-4, CEM-3, CEM-1, FR-1, FR-2, XPC, Aluminum. 
"HALOGEN FREE, HIGH CTI, HIGH Tg, by special order"
Base Copper Foil 0.5 oz to 3 oz for Glass Epoxy laminate, 1 oz for Paper Phenolic, 
0.5 oz minimum copper design for inner-layer
Major Laminate Kingboard, Doosan, ShengYi, Isola
Types of Surface Finish Flash gold (Electrolytic), Hard gold plating,
Electroless nickel Immersion gold (Electroless Ni/Au), 
Organic Solderability Preservatives (Entek), Hot Air Leveling (Tin/Lead),
Hot Air Leveling (Pb Free), 
Carbon Ink, Peelable Mask. Gold Fingers (30µ"), Silver Paste
Min. Drill Bit Size 0.2 mm (finished) , Aspect Ratio=8
Via Holes COPPER PTH, Blind Via / Buried Via
Impedance Control Tol +/- 10% (min. +/- 7 Ohm)
Min. Line 
Width & Spacing		 0.10 mm / 0.10 mm ( 4 mil / 4 mil )
Soldermask Liquid Photo-image (LPI), Silkscreen Ink : Thermal Cure, UV Cure
Profile Routing, Punching, Push Back, CNC V-cut, Connector Chamfering
Fabrication Data Inputs
   
 
Type Preferred Usable
Gerber Electronic Files RS-274-X or RS-274-D GC-CAM / View2000
Print Files HPGL Gerber, DXF, Auto Cad
Drill Files ASCII Excellon, Gerber, Trudrill
Aperture List Standard Wheel with D-code List If RS-274-D is used
 
Pre-Production Engineering
   
  Once we receive the purchase order, Gerber files, drill files with fabrication drawing, the first step is to perform CAM review to ensure compliance to GCB guidelines and quality control standards. In case of design / board requirement conflict, we will inform our MKT to contact the customer for resolve. Then the files will be transferred to Laser Plot for artwork generation.
 
Fabrication Drawing Information
Considerations during the Design Process
   
 
1 Material information including : material type, copper weight, any special considerations.
2 Hole size information including : finished size and tolerance, plate thru or non - plate thru.
3 Board size including : length and width, hole to edge.
4 Solder mask requirements if there is any special consideration.
5 Tolerance block for dimensions.
6 Board thickness and tolerance.
7 Finish requirements.
8 Array drawing (sub. panel)
9 The drawing should be included length and width dimensions, hole to edge dimension, datum hole (0-0 location), tooling hole locations, cutout locations, slot locations, bevel requirements.
 
Multilayer Board Lay-up
Considerations during the Design Process
   
 
1 Layer Stackup :
 
a) When possible, specify copper weight identically for each layer throughout the stack up.
b) Lay-up sequence must be specified.
c) Free lay-up is preferred. Generally specify overall thickness only so that standard materials can be used.
d) If lay-up construction is specified, balance the dielectric spacing is recommended. So that it is symmetrical in the Z axis. (These steps help reduce warpage.)
e) 1~2 oz copper for inner layers is standard. Other claddings are available from our suppliers 3 oz etc... These thickness may require additional lead time.
f) For controlled impedance boards, specify overall finish thickness and tolerance, layer sequence and calculated dielectric's between layers. Specify designed trace width and impedance value for each layer. We will run a model and verify that the calculations are correct.
2 Innerlayers :
 
a) Ground and power layers :
 
i. Clearance pads (unclad area) must be a minimum diameter of 0.60 mm larger than drilled hole size. In limited cases we can go lower.
ii. Remove unused pads in clearance area.
 
b) Connection pads (thermal pads) :
 
i. Internal pad size to be : drilled hole size plus 0.30 mm for 0.25 mm min. annular ring.
ii. Outside diameter to be : internal pad size plus 0.50 mm.
iii. Specify : 
Number of spokes : 4 preferred
Width of spokes : 0.20 mm
Degree of spokes : 45
c) Routing clearance around perimeter of finished board. The " unclad area" area around the edge of the boards must be equal to or greater than 0.64 mm on all ground and power layers.
d) Label clearly on the artwork the layer number and description (i.e., L1, L2, L3, L4 and etc.)
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